Liquid metal initiator of ring-opening polymerization: Self-capsulation into thermal/photo-moldable powder for multifunctional composites. Advanced Materials, 2020, X. Li, M. Li, Q. Shou, L. Zhou, A. Ge, D. Pei, C. Li, DOI: 10.1002/adma.202003553.-成果-仿生智能材料研究组  
Liquid metal initiator of ring-opening polymerization: Self-capsulation into thermal/photo-moldable powder for multifunctional composites. Advanced Materials, 2020, X. Li, M. Li, Q. Shou, L. Zhou, A. Ge, D. Pei, C. Li, DOI: 10.1002/adma.202003553. 2020 智能软物质 论文
lixk 2020-9-22 2203

Liquid metal nanodroplets not only share the similar metallic properties and nanoscale effect with solid metal nanoparticles, but also possess the additional uniqueness in nonvolatile fluidity and ambient sintering ability into continuous conductors. In most cases, liquid metal nanodroplets were encapsulated into ultrathin and fragile shells of oxides and amphiphile monolayers, and may be hindered from incorporating homogeneously into various composites through conventional processing methods. In this study, ring-opening polymerization was found for the first time to be initiated by sonicating liquid metal of EGaIn in fluidic lactones. By this in-situ polymerization, EGaIn nanodroplets were encapsulated into polylactone shells with tunable thickness, which could further be dried into the solid powder. Besides high chemical stability and dispersibility in organic solvents, the powder of EGaIn capsules combined exceptional properties of EGaIn droplets (e.g., photo-thermal effect) and polylactone shells (e.g., biocompatibility, biodegradability and compatibility with different polymer matrix), being capable of introducing into thermoplastic composites through liquid casting and thermal-/photo-molding for notch-insensitive tearing property, sintering-induced electric conductivity and photo-thermal effect. Thus EGaIn initiator of ring-opening polymerization may start a pathway to produce stable and thermal/photo-moldable powder of EGaIn capsules and their multifunctional composites applicable in biomedicines, soft electronics and smart robots.



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